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They have read the IPC standard IPC-J-STD-033C & 1601 and thus are aware of MSD and MSL component levels. Super Dry® by Totech has extensive
Mar 1, 2018 –
4.8 Moisture Sensitivity Update J-STD-020/033/075. P.1. JEDEC / JEITA J-STD-033C Balloted. • JEDEC and IPC stating that the document only covers wire bond packages was proposed. It was decided The style manual does not allow
IPCJEDECSTD033C2012-Handling, Packing, Shipping and Use of Standards PDF Cover Page preview. Historical. IPC/JEDEC J-STD-033C-2012. HandlingApr 1, 2018 –
Feb 13, 2012 –
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount 13 v IPC/JEDEC J-STD-033C February 2012 Figure 3-7 MBB with Too Much 1: Manual handling may increase the risk of mechanical and/or ESD damage.
STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State NOTE 1 Manual handling may increase the risk of mechanical and/or ESD damage.
This document provides SMD manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs.
Feb 13, 2012 –
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